Adhesive bonding, dispensing and potting technologies that set standards
For more than 30 years, customers worldwide have trusted in our technology. The productline Scheugenpflug within Atlas Copco is one of the leading manufacturers of innovative bonding, dispensing and potting systems for automotive, electronic or medical solutions.
Good news: Scheugenpflug is changing to Atlas Copco
Atlas Copco brings people, technologies, innovations and expertise together. Globally. We, the experts in automated electronics dispensing at Atlas Copco, will therefore be able to provide you with even more competent and comprehensive support in the future.
Benefit from:
✓ Even more innovative dispensing, joining and assembly solutions to meet your specific requirements
✓ Even more experts in the global network of experienced sales and service professionals
✓ Everything from a single source – an extended product range and extensive know-how for whatever field you work in
Legal information at a glance:
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If you’re looking to….
All Scheugenpflug systems are scalable and based on a pioneering modular system. Find your ideal individual customized automation solution from a single source.
Our system solutions cover all current dispensing tasks for electronic workpieces and components – reliably and efficiently. Find the right system solution for your application.
Dispensing and potting projects are rarely standard. Test economic efficiency and process reliability for your application in our Technology and Application Center.
Safe driving thanks to reliably protected electronics
Modern vehicles rely on durable, high-performance electronic components. The right dispensing and potting technology is crucial here.
With effective heat dissipation and reliable potting and sealing techniques, we can extend the life of the components and ensure maximum safety on the road. Protect your electronics with Scheugenpflug’s dispensing technology – for safe, relaxed journeys today and tomorrow.
Potting Projects Rarely Fit the Standard Mold
Heat Dissipation
Dispensing technology for abrasive thermal interface materials (TIM)
Sealing
Sealing of silicone-based liquid gaskets (FIPG und CIPG)
Bonding
Metering of industrial adhesives
Encapsulation
Application of casting resin for protecting PCBs
DISPENSING UNDER ATMOSPHERIC CONDITIONS
Bubble free potting of electronics with low viscosity fluids
DISPENSING UNDER VACUUM
Bubble free potting of electronics with low viscosity fluids
Technology and Application Center
We make innovations successful and sustainable. By working with you to make the best possible preparations.
Take advantage of our decades of experience right from the product development phase. Test your application using the well-equipped research and testing infrastructure of our Technology and Application Center. Get answers to your questions about materials, components, cycle times and the potting solution that suits you best.
