Reliable heat management
The rising power densities and high functional safety required for components such as chips, printed circuit boards or power electronics means they require effective heat management.
The fluid thermal interface materials (TIM) used here offer numerous advantages compared to solid, stamped pads or films: Individual component contours are not a problem. In general, fluid materials also have a greater thermoconductivity. The preparation and dispensing of these highly filled, abrasive materials are no longer a challenge with our system solutions.
Find the answer which aspects need to be taken into account when dispensing thermal interface materials in our new white paper.
Overview of standard requirements
Our proven system solution for applying thermally conductive materials comprises the A280 material feed system, a DosP DP803 TCA dispenser and the DC803 DispensingCell. The material feed and dispenser are specially designed for processing highly abrasive materials. The extremely viscous thermally conductive material is fed from the material drum via material feed lines to the dispenser. This then applies the material on the component in the form required. Precise material application in three dimensions is ensured by installing the dispenser on the CNC axis system of the dispensing cell.
The highlights of our system solution at a glance
Innovative EViS and UViS 5 operation concepts for simple handling – with UPiC 5 for dispensing program setup, including simple matrix or CNC programming, 3D visualization of workpiece and intelligent dispensing contour creation
Stringent dispensing precision through optimized volumetric metering system (increased system rigidity, optimized material flow and wear-resistant components)
High process safety through monitoring of all relevant parameters, plus sensor-based valve function monitoring, etc.
Dispensing highly filled, abrasive materials carefully, economically and with process safety