From entry-level systems to high-end-solutions

The rapid growth in demand for very small electronic components in all branches of industry calls for innovative joining processes.

High-performance bonding and potting processes enable sensitive components to be protected from mechanical, chemical and corrosive influences. They also lead to longer service lives.

Dispensing and potting

It is not only in lightweight construction in the automotive industry that established joining processes such as bolting and welding are increasingly being supplemented and, in some cases, completely replaced by powerful bonding processes. Modern dispensing and potting processes enable complex designs to be produced.

With the right dispensing systems, high levels of precise repeatability can now be achieved and a wide variety of different bonding, dispensing and potting tasks can be reliably completed. 

system solutions for every task

The performance of a dispensing system depends to a large extent on a powerful and efficient material preparation and feeding system that is tailored to the material and to the application. Our system solutions are future-proof and designed to handle all current dispensing tasks for electronic components with high levels of reliability. Each of our dispensing system solutions includes both the material preparation system and the dispensing system, complemented by an intuitive control and visualization system.

More about the Scheugenpflug system Solutions

Customized automated systems

Scheugenpflug offers efficient dispensing systems, ranging from individually adaptable manual workstations and powerful potting cells and systems to modules for integrating in automated production. Thanks to Scheugenpflug’s proven modular approach, the scope and degree of automation of the dispensing systems can be flexibly adapted to suit customer requirements.

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Sebastian Nadler

Sales expert

Phone: +49 9445 9564 0

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