Vacuum Bonding: Patented Process for the Strictest Quality Requirements

Non-destructive bonding of delicate electronics

Vacuum bonding is a method patented by Scheugenpflug that enables bonding of delicate electronic assemblies without mechanical stress. Unlike conventional methods, this method does not use pressure pins, making it possible to process the electronic components carefully without the risk of damage or cracking.

Vacuum bonding is a patented method that enables non-destructive bonding of delicate electronic assemblies without causing the mechanical stress which may occur as a result of using pressure pins. At the same time, this solution also meets the growing demands for efficient thermal management. Many electronic components today offer higher component density and increasing performance. Heat dissipation must be reliably effective in order to prevent drops in performance or faults and failures due to overheating. The fully automated vacuum bonding process developed by Scheugenpflug guarantees optimum distribution of the thermoconductive material without undesirable air pockets.

Vacuum bonding: method and advantages

The first step in vacuum bonding is to apply a high-filled, thermally conductive adhesive to a heat sink in concentric lines. The adhesive beads do not cover the surface completely at this point. The fillers in the potting material provide not only reliable heat dissipation, but also define the necessary gap (typically around 0.1 mm). The complete piece, such as a PCB, is placed on top of the adhesive bead and is then inserted into a compact vacuum chamber. The size of the vacuum chamber is deliberately kept rather small, in order to ensure that it can be quickly and thus cost-effectively evacuated. The resulting decrease in pressure to approximately 5 mbar extracts and evacuates the air from the space around the component and between the adhesive beads. The chamber is then ventilated, while at the same time the bonded component is exposed to uniform atmospheric pressure. This drives the PCB and the heat sink closer together and without any mechanical stress until only the distance defined by grains contained in the adhesive remains.

Vacuum bonding enables the uniform, smooth distribution of the adhesive without air pockets, thus providing ideal heat dissipation. Unlike conventional bonding methods in which the components are pressed on the intended substrate using pressure pins, in this method, the pressure is distributed evenly over the entire surface, preventing unnecessary stress on the component. This practically eliminates the occurrence of rejected parts due to cracking, for instance. Due to the small size of the vacuum chamber and the use of proven Scheugenpflug adhesive bonding, dispensing and potting systems, operators simultaneously benefit from short cycle times and high process reliability and economic efficiency.

Customized manufacturing tailored to your needs
  • The A280 feeding system provides reliable material feeding of highly abrasive and high viscosity potting media. The double piston pump integrated in this system provides for a long workpiece pot life and low maintenance costs, since a rinsing liquid prevents abrasive fillers from sticking to the seals.
    Learn more about the A280

To save time and money, always make sure during vacuum processing that the potting system used is matched to the particular task. Systems optimized for the patented vacuum bonding method in particular are always manufactured to customer specifications. Do you have any questions about the process, or would you like a quote for a service or product? Please feel free to contact Sales at any time: Contact.

TIP: Optimum distribution of thermally conductive adhesives after vacuum bonding greatly depends on the potting contour. In addition to the workpiece geometry, the pourability of the potting material used plays a decisive role in this case.

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